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Mining operations and electronics manufacturing sectors have gained a new tool for high-precision bonding with the introduction of Master Bond’s LED422DC90, an innovative dual-cure adhesive system that promises to revolutionize assembly processes for heat-sensitive components in demanding environments.
The newly developed adhesive stands out for its unique “side-bonding” capability, which enables rapid polymerization of opaque substrates up to 3-4 mm in depth. Unlike convention

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